Display device

ABSTRACT

Disclosed is a display device possessing: a substrate having a display region and a peripheral region surrounding the display region; a pixel over the display region; a passivation film over the pixel; a resin layer over the passivation film; a first dam over the peripheral region and surrounding the display region; and a second dam surrounding the first dam. The passivation film includes; a first layer containing an inorganic compound; a second layer over the first layer, the second layer containing an organic compound; and a third layer over the second layer, the third layer containing an inorganic compound. The second layer is selectively arranged in a region surrounded by the first dam. The resin layer is selectively arranged in a region surrounded by the second dam.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based on and claims the benefit of priority from theprior Japanese Patent Application No. 2017-104504, filed on May 26,2017, the entire contents of which are incorporated herein by reference.

FIELD

The present invention relates to a display device and a manufacturingmethod of the display device. For example, the present invention relatesto a display device having an organic light-emitting element in eachpixel and a manufacturing method thereof.

BACKGROUND

An organic EL (Electroluminescence) display device has been known as atypical example of a display device. An organic EL display device has anorganic light-emitting element (hereinafter, referred to as alight-emitting element) in each of multiple pixels formed over asubstrate. A light-emitting element has a layer containing an organiccompound (hereinafter, referred to as an EL layer or an organic layer)between a pair of electrodes and is operated by supplying currentbetween the pair of electrodes. During operation of the light-emittingelement, the organic compound is oxidized or reduced to exist in acharged state which further undergoes recombination to generate anexcited state. Since such an active species in a charged state or anexcited state has higher reactivity than a compound in an electricallyneutral state or a ground state thereof, the active species reacts withanother organic compound or readily reacts with impurities entering thelight-emitting element, such as water and oxygen. Products resultingfrom these reactions influence the properties of the light-emittingelement and cause reduction in efficiency and lifetime of thelight-emitting element.

Japanese Patent Application Publication No. 2015-15089 discloses, as amethod for suppressing deterioration in such properties, forming aregion (shielding region) for blocking impurities between a displayregion including light-emitting elements and a peripheral regionsurrounding the display region. The formation of the shielding regioneffectively prevents impurities from entering particularly from an edgeportion of a substrate, which improves reliability of a display device.

SUMMARY

An embodiment of the present invention is a display device. This displaydevice possesses: a substrate having a display region and a peripheralregion surrounding the display region; a pixel over the display region;a passivation film over the pixel, a resin layer over the passivationfilm; a first dam over the peripheral region and surrounding the displayregion; and a second dam surrounding the first dam. The passivation filmincludes; a first layer containing an inorganic compound; a second layerover the first layer, the second layer containing an organic compound;and a third layer over the second layer, the third layer containing aninorganic compound. The second layer is selectively arranged in a regionsurrounded by the first dam. The resin layer is selectively arranged ina region surrounded by the second dam.

An embodiment of the present invention is a display device. This displaydevice possesses: a substrate having a display region and a peripheralregion surrounding the display region; a pixel over the display region;and an auxiliary wiring over the peripheral region and surrounding thedisplay region. The pixel includes a light-emitting element having apixel electrode, an opposing electrode, an organic layer sandwiched bythe pixel electrode and the opposing electrode and a partition wallcovering an edge portion of the pixel electrode. The pixel electrode andthe auxiliary wiring have the same stacked-layer structure, and theauxiliary wiring and the opposing electrode are electrically connectedto each other. The partition wall extends from the display region to theperipheral region and covers a first edge portion and a second edgeportion of the auxiliary wiring, the second edge portion opposing thefirst edge portion.

An embodiment of the present invention is a display device. This displaydevice possesses: a substrate having a display region and a peripheralregion surrounding the display region; a pixel over the display region;and a first dam over the peripheral region and surrounding the displayregion. The pixel includes: a transistor; a leveling film over thetransistor; a light-emitting element over the leveling film, thelight-emitting element including a pixel electrode, an opposingelectrode, and an organic layer between the pixel electrode and theopposing electrode; and a partition wall covering an edge portion of thepixel electrode and sandwiched between the pixel electrode and theorganic layer. The partition wall extends to the peripheral region andoverlaps with the first dam.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic top view of a display device according to anembodiment of the present invention;

FIG. 2A and FIG. 2B are schematic cross-sectional views of a displaydevice according to an embodiment of the present invention;

FIG. 3A and FIG. 3B are schematic top views of a display deviceaccording to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of a display device accordingto an embodiment of the present invention;

FIG. 5 is a schematic top view of a display device according to anembodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a display device accordingto an embodiment of the present invention;

FIG. 7 is a schematic top view of a display device according to anembodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of a display device accordingto an embodiment of the present invention;

FIG. 9 is a schematic top view of a display device according to anembodiment of the present invention;

FIG. 10 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 11 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 12 is a schematic cross-sectional view for explaining amanufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 13 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 14 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 15A and FIG. 15B are schematic cross-sectional views for explaininga manufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 16A and FIG. 16B are schematic cross-sectional views for explaininga manufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 17A and FIG. 17B are schematic cross-sectional views for explaininga manufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 18A and FIG. 18B are schematic cross-sectional views for explaininga manufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 19 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 20 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 21 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 22A and FIG. 22B are schematic cross-sectional views for explaininga manufacturing method of a display device according to an embodiment ofthe present invention;

FIG. 23 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention;

FIG. 24 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention; and

FIG. 25 is a schematic cross-sectional view of a display deviceaccording to an embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

Hereinafter, the embodiments of the present invention are explained withreference to the drawings. The invention can be implemented in a varietyof different modes within its concept and should not be interpreted onlywithin the disclosure of the embodiments exemplified below.

The drawings may be illustrated so that the width, thickness, shape, andthe like are illustrated more schematically compared with those of theactual modes in order to provide a clearer explanation. However, theyare only an example, and do not limit the interpretation of theinvention. In the specification and the drawings, the same referencenumber is provided to an element that is the same as that which appearsin preceding drawings, and a detailed explanation may be omitted asappropriate.

In the present specification and claims, when a plurality of films isformed by processing one film, the films may have functions or rolesdifferent from each other. However, the films each originate from a filmformed as the same layer in the same process and has the same layerstructure and the same material. Therefore, the films are defined asfilms existing in the same layer.

In the specification and the claims, unless specifically stated, when astate is expressed where a structure is arranged “over” anotherstructure, such an expression includes both a case where the substrateis arranged immediately above the “other structure” so as to be incontact with the “other structure” and a case where the structure isarranged over the “other structure” with an additional structuretherebetween.

In the present specification and claims, an expression “a structuralbody is exposed from another structural body” means an aspect where aportion of the structural body is not covered by the other structuralbody and includes an aspect where the portion which is not covered bythe other structural body is covered by yet another structural body.

First Embodiment 1. Outline Structure

A schematic top view of a display device 100 of an embodiment of thepresent invention is shown in FIG. 1. The display device 100 includes alight-emitting element as a display element.

As shown in FIG. 1, the display device 100 has a substrate 102 overwhich a plurality of pixels 104 is provided. A region in which thepixels 104 are disposed and a region surrounding this region arerespectively defined as a display region 106 and a peripheral region ofthe substrate 102. Driver circuits for driving the pixels 104 are formedin the peripheral region. In the example shown in FIG. 1, two gate-sidedriver circuits 108 sandwiching the display region 106 and a source-sidedriver circuit 118 including analogue switches and the like areprovided. Wirings which are not illustrated extend from the displayregion 106, the gate-side driver circuits 108, and the source-sidedriver circuit 118 to a side of the substrate 102 and are exposed at anedge portion of the substrate 102 to form terminals 112. The terminals112 are electrically connected to a connector 114 such as a flexibleprinted circuit (FPC) substrate. A driver IC 110 for controlling thepixels 104 may be further mounted over the connector 114 or thesubstrate 102. Note that the source-side driver circuit 118 may not beprovided over the peripheral region, and functions thereof may berealized by the driver IC 110. A light-emitting element 160 is disposedin each pixel 104 and controlled with the gate-side driver circuits 108,a source-side driver circuit 118, and the like, by which an image can bedisplayed on the display region 106.

As described below in detail, the display device 100 possesses, in theperipheral region, an auxiliary wiring 204 surrounding the displayregion 106. As shown in FIG. 1, the auxiliary wiring 204 maycontinuously surround the display region 106. The display device 100further possesses a barrier wall (hereinafter, referred to as a dam)provided in the peripheral region so as to surround the auxiliary wiring204. Specifically, the display device 100 has a first dam 210continuously surrounding the display region 106 and the auxiliary wiring204 and a second dam 212 surrounding the first dam 210.

2. Pixel 2-1. Pixel Circuit

A schematic cross-sectional view of two adjacent pixels 104 is shown inFIG. 2A. A pixel circuit including a variety of elements such as atransistor and a capacitor element is formed in each pixel 104 inaddition to the light-emitting element 160. The number and theconnection relationship of these elements are not limited. Thelight-emitting element 160 as well as a storage capacitor 140 and atransistor 130 connected to the light-emitting element 160 areillustrated in FIG. 2A as an example. The pixel circuit and thelight-emitting element 160 are arranged between the substrate 102 and anopposing substrate 116.

The transistor 130 and the storage capacitor 140 are provided over thesubstrate 102 with an undercoat 120 sandwiched therebetween. Thesubstrate 102 has a function to support the circuits formed thereoverand may include glass, quartz, or a polymer. The use of a polymer suchas a polyimide, a polyamide, and a polycarbonate for the substrate 102and the opposing substrate 116 provides flexibility to the displaydevice 100, allowing production of a so-called flexible display. Theundercoat 120 is an insulating film formed for preventing diffusion ofimpurities originating from the substrate 102.

The transistor 130 possesses a semiconductor film 132, a gate insulatingfilm 122 over the semiconductor film 132, a gate electrode 134 over thegate insulating film 122, a first interlayer film 124 over the gateelectrode 134, a second interlayer film 126 over the first interlayerfilm 124, source/drain electrodes 136 and 138 over the second interlayerfilm 126, and the like. The semiconductor film 132 may have an activeregion 132 a, low-concentration impurity regions 132 b sandwiching theactive region 132 a, high-concentration impurity regions 132 csandwiching these regions, and the like. Although the transistor 130 isillustrated as a transistor having a top-gate structure in FIG. 2A, thestructure of the transistors structuring the pixel circuit is notlimited, and transistors with a variety of structures may be utilized.Note that the second interlayer film 126 is an optional structure andmay be omitted.

The storage capacitor 140 is composed of a part of the semiconductorfilm 132 (high-concentration impurity region 132 c), the gate insulatingfilm 122 thereover, a capacitor electrode 142 existing in the same layeras the gate electrode 134, the first interlayer film 124 over thecapacitor electrode 142, the second interlayer film 126, and a part ofthe source/drain electrode 138. Here, the gate insulating film 122, thefirst interlayer film 124, and the second interlayer film 126 functionas a dielectric of the storage capacitor 140. An inorganic compoundcontaining silicon may be used for the undercoat 120, the gateinsulating film 122, the first interlayer film 124, and the secondinterlayer film 126, for example. As an inorganic compound containingsilicon, silicon oxide containing oxygen and silicon as well as siliconnitride, silicon oxynitride, and silicon nitride oxide containingoxygen, silicon, and nitrogen, and the like are exemplified. These filmsmay have a single-layer structure or a stacked-layer structure.

A leveling film 150 is further formed over the transistor 130 and thestorage capacitor 140. Depressions and projections caused by the pixelcircuit including the transistor 130 and the storage capacitor 140 areabsorbed by the leveling film 150, giving a flat surface. The levelingfilm 150 may contain a polymer exemplified by an acrylic resin, an epoxyresin, a polysiloxane, a polyimide, a polyamide, and the like. Althoughnot illustrated, an insulating film containing an inorganic compound maybe disposed, as an optional structure, between the leveling film 150 andthe source/drain electrodes 136 and 138 as an interlayer film.

An opening reaching the source/drain electrode 138 is formed in theleveling film 150, and a connection electrode 152 covering this openingand a part of the leveling film 150 is provided so as to be in contactwith the source/drain electrode 138. A third interlayer film 154 isfurther formed so as to cover the connection electrode 152. The thirdinterlayer film 154 is also an insulating film. The silicon-containinginorganic compounds described above can be used for the third interlayerfilm 154, and silicon nitride is typically employed. The thirdinterlayer film 154 does not cover a part of the connection electrode152 in the opening formed in the leveling film 150 to allow a topsurface of the connection electrode 152 to be exposed. This structureenables electrical connection between the connection electrode 152 and apixel electrode 162 formed thereover. An opening 155 may be formed inthe third interlayer film 154 to allow contact of a partition wall (alsocalled rib or bank) 170 formed thereover with the leveling film 150.Note that the formation of the connection electrode 152 and the opening155 is optional. The formation of the connection electrode 152 preventsoxidation of a surface of the source/drain electrode 138 in thefollowing processes, thereby suppressing an increase in contactresistance due to the oxidation. The opening 155 functions as an openingto release impurities from the leveling film 150, such as water andoxygen, and the formation of the opening 155 improves reliability of thesemiconductor elements in the pixel circuit and the light-emittingelement 160.

The pixel electrode 162 is formed over the third interlayer film 154 soas to cover the connection electrode 152. The pixel electrode 162 iselectrically connected to the source/drain electrode 138 through theconnection electrode 152 in the opening formed in the leveling film 150.

2-2. Light-Emitting Element

The pixel electrode 162 may include a conductive material exhibiting atransmitting property with respect to visible light, a metal such assilver and aluminum, or an alloy including at least one metal selectedfrom these metals. The pixel electrode 162 may have a single-layerstructure or a stacked-layer structure. In the case of a stacked-layerstructure, a structure may be employed in which a first conductive layer162_1, a second conductive layer 162_2 over the first conductive layer162_1, and a third conductive layer 162_3 over the second conductivelayer 162_2 are stacked in this order as shown in FIG. 2B, for example.

The first conductive layer 162_1 has a transmitting property withrespect to visible light and may include a mixed oxide of indium and tin(ITO), a mixed oxide of indium and zinc (IZO), or the like. The firstconductive layer 162_1 more firmly fixes the second conductive layer162_2 over the third interlayer film 154. The second conductive layer162_2 preferably has a high reflectance with respect to visible lightand may include 0-valent silver, 0-valent aluminum, 0-valent magnesium,or an alloy including a metal selected from these metals. A thickness ofthe second conductive layer 162_2 may be equal to or more than 100 nmand equal to or less than 200 nm, equal to or more than 120 nm and equalto or less than 160 nm, or equal to or more than 120 nm and equal to orless than 140 nm and is typically 130 nm. Since such a thicknessinhibits visible light from passing therethrough, the second conductivelayer 162_2 exhibits a high reflectance. Therefore, light emissionobtained from the light-emitting element 160 is efficiently reflectedand can be extracted through the opposing substrate 116. Additionally,the formation of the second conductive layer 162_2 with such a thicknessresults in a sufficiently low electrical resistance. The thirdconductive layer 162_3 has a transmitting property with respect tovisible light and may typically contain ITO or IZO. Since ITO and IZOhave a relatively high work function, holes can be efficiently injectedto an organic layer 164 when the pixel electrode 162 is allowed tofunction as an anode.

The organic layer 164 and an opposing electrode 166 thereover areprovided so as to cover the pixel electrode 162 and the partition wall170. The light-emitting element 160 is formed by the pixel electrode162, the organic layer 164, and the opposing electrode 166. In thepresent specification and claims, the organic layer 164 means all of thelayers disposed between the pixel electrode 162 and the opposingelectrode 166. Carriers (holes and electrons) are injected to theorganic layer 164 from the pixel electrode 162 and the opposingelectrode 166, and emission is obtained through a radiative decayprocess of an excited state generated by recombination of the carriers.

Although the organic layer 164 is illustrated so as to have asingle-layer structure in FIG. 2A, the organic layer 164 may be composedof a plurality of layers and may be formed by combining layers having avariety of functions, such as a carrier-injection layer, acarrier-transporting layer, an emission layer, a carrier-blocking layer,and an exciton-blocking layer. The structure of the organic layer 164may be the same in all of the pixels 104, or the organic layer 164 maybe configured so that the structure thereof is different betweenadjacent pixels 104. For example, the organic layer 164 is formed sothat a structure or a material of the emission layer is differentbetween adjacent pixels 104, by which light emissions with differentcolors are attenable from adjacent pixels 104. When the same organiclayer 164 is used in all of the pixels 104, a plurality of emissioncolors can be obtained by using a color filter on the opposing substrate116.

The opposing electrode 116 is formed across the plurality of pixels 104.That is, the opposing electrode 166 is shared by the plurality of pixels104. The opposing electrode 166 exhibits a transmitting property withrespect to visible light and may be formed by using a conductive oxidehaving a light-transmitting property, such as ITO and IZO.Alternatively, the opposing electrode 166 may be formed by forming afilm including silver, aluminum, magnesium, or an alloy containing ametal selected from these metals at a thickness which allows visiblelight to pass therethrough.

2-3. Other Structures

A protection film (hereinafter, referred to as a passivation film) 180for protecting the light-emitting elements 160 is provided over thelight-emitting elements 160. The structure of the passivation film 180may be arbitrarily selected, and a stacked-layer having a first layer182 containing an inorganic compound, a second layer 184 containing anorganic compound, and a third layer 186 containing an inorganic compoundmay be applied to the passivation film 180 as shown in FIG. 2A. In thiscase, the above-described inorganic compounds containing silicon may beused as an inorganic compound. A polymer material such as an epoxy resinor an acrylic resin may be used as an organic compound.

The second layer 184 may have a relatively large thickness, by whichdepressions and projections caused by the partition wall 170 areabsorbed to provide a flat top surface, and the third layer 186 can beformed thereover. Hence, planarity of the third layer 186 is improved,and generation of a crack or a pinhole in the third layer 186 can beprevented, thereby effectively suppressing entrance of impurities.

A resin layer 190 is provided over the passivation film 180. The resinlayer 190 is a layer used as a mask to expose the terminals 112 byremoving, with an etching treatment, the first layer 182 and the thirdlayer 186 formed over the terminals 112 and has a function to protectthe passivation film 180 in the etching treatment. The resin layer 190includes a polymer material such as an acrylic resin or an epoxy resin.

An opposing substrate 116 is fixed to the substrate 102 with an adhesivelayer 192 composed of an organic material so as to sandwich thelight-emitting element 160 and the pixel circuit, by which thelight-emitting element 160 and the pixel circuit are sealed. Althoughnot illustrated, a touch sensor may be fabricated between thepassivation film 180 and the resin layer 190.

3. Peripheral Region

As described above, the display device 100 possesses the auxiliarywiring 204 as well as the first dam 210 and the second dam surroundingthe auxiliary wiring 204 in the peripheral region. The structuresthereof are described below.

3-1. Structure of Upper Side of Substrate

A schematic top view of the peripheral region and the display region 106(region 102_1 in FIG. 1) close to a side (hereinafter, referred to as anupper side or first side) of the substrate 102 opposing a side alongwhich the terminals 112 are arranged is shown in FIG. 3A, and aschematic view of a cross section along a chain line A-A′ in FIG. 3A isshown in FIG. 4. As shown in FIG. 3A and FIG. 4, wirings 220 and 222extending substantially parallel to the upper side of the substrate 102are disposed in the peripheral region between the display region 106 andthe upper side of the substrate 102. The number, usage, and function ofthe wirings 220 and 222 are not limited. For example, the wirings 220and 222 each may function as a power-source line for supplying aconstant potential to the pixel electrodes 162 or a signal line totransmit a variety of signals to the driver circuits. An example isshown in FIG. 4 in which the wirings 220 and 222 exist in the same layeras the source/drain electrodes 136 and 138. However, the wirings 220 and222 may exist in the same layer as the gate electrode 134.

The leveling film 150 provided in the pixels 104 also extends in adirection toward the upper side of the substrate 102 to cover thewirings 220 and 222 (FIG. 4). However, the leveling film 150 is partlyremoved in the peripheral region, and the first dam 210 and the seconddam 212 are formed by the remaining leveling film 150. Therefore, thefirst dam 210, the second dam 212, and the leveling film 150 have thesame composition as one another and are spaced from one another.

The third interlayer film 154 is spaced from the second interlayer film126 (from the first interlayer film 124 in the case where the secondinterlayer film 126 is not provided) in the display region 106. However,there are regions (hereinafter, shielding region) 156 in which the thirdinterlayer film 154 is in contact with the second interlayer film 126 orthe first interlayer film 124 in the peripheral region. At least twoshielding regions 156 are provided, and the first dam 210 existing inthe same layer as the leveling film 150 is positioned between these twoshielding regions 156_1 and 156_2. Furthermore, the second dam 212existing in the same layer as the leveling film 150 is positionedbetween the shielding region 156_2 and the upper side of the substrate102. Hence, the shielding region 156_2 is a region sandwiched by thefirst dam 210 and the second dam 212, and the shielding region 156_1 isa region sandwiched by the first dam 210 and the leveling film 150.

The auxiliary wiring 204 existing in the same layer as the pixelelectrode 162 is further provided in the peripheral region. Theauxiliary wiring 204 may be formed so as to overlap with the wirings 220and 222 or the leveling film 150. Although the pixel electrodes 162 andthe auxiliary wiring 204 are not in physical contact with each other,they are able to have the same stacked-layer structure because they canbe formed in the same process. For example, the auxiliary wiring 204 mayhave the structure in which the first conductive layer 162_1, the secondconductive layer 162_2, and the third conductive layer 162_3 are stackedin this order as shown in FIG. 2B.

Here, a part of the auxiliary wiring 204 is also located in theshielding region 156_1 as shown in FIG. 4. Moreover, an edge portion ofthe auxiliary wiring 204 (an edge portion opposite to the display region106. Hereinafter, referred to as a first edge portion) may overlap withthe first dam 210. That is, the auxiliary wiring 204 may be arranged sothat the first edge portion overlaps with a sidewall of the first dam210. Alternatively, the first edge portion of the auxiliary wiring 204may not overlap with the sidewall of the first dam 210 but may belocated between the first dam 210 and the leveling film 150 as shown inFIG. 5.

As shown in FIG. 4, the partition wall 170 is located not only in thedisplay region 106 but in the peripheral region, and a part thereofoverlaps with the shielding region 156_1 and covers the first dam 210.More specifically, as can be understood from FIG. 2A, FIG. 3A, and FIG.4, the partition wall 170 has a plurality of openings overlapping withthe pixel electrodes 162 in the display region 106 to allow the pixelelectrodes 162 to be in contact with the organic layer 164. In addition,the partition wall 170 not only covers an edge portion (an edge portionon a side of the display region 106. Hereinafter, referred to as asecond edge portion) of the auxiliary wiring 204 opposing the first edgeportion but also has a plurality of openings 214 overlapping with theauxiliary wiring 204 in the peripheral region. The opposing electrode166 is electrically connected to the auxiliary wiring 204 through theopenings 214. The auxiliary wiring 204 is applied with a constantpotential and connected to a periphery of the opposing electrode 166 asdescribed below. Therefore, a constant potential can be maintained inthe whole of the opposing electrode 166.

As shown in FIG. 4, a top surface of the auxiliary wiring 204 can becovered with the partition wall 170 in the shielding region 156_1. Adepression or a projection is readily formed on the top surface of theauxiliary wiring 204, particularly on the top surface of the edgeportion thereof. Therefore, when the auxiliary wiring 204 is in contactwith the first layer 182 of the passivation film 180, a pinhole isreadily generated in the first layer 182. However, it is possible toprevent the generation of a pinhole by covering the top surface of theauxiliary wiring 204 with the partition wall 170. Note that, it is notalways necessary that the partition wall 170 cover the whole of the topsurface of the auxiliary wiring 204, and the partition wall 170 mayselectively cover the first edge portion of the auxiliary wiring 204 andthe second edge portion to allow the top surface other than these edgeportions to be in contact with the first layer 182.

In the example shown in FIG. 3A, the plurality of openings 214 is usedfor electrical connection between the opposing electrode 166 and theauxiliary wiring 204. However, the number of the openings 214 is notlimited, and a single opening 214 extending parallel to the upper sidemay be formed to connect the opposing electrode 166 to the auxiliarywiring 204 as shown in FIG. 3B.

The first layer 182 and the third layer 186 of the passivation film 180are provided so as to overlap with the first dam 210 and the second dam212. On the other hand, the second layer 184 is selectively arrangedover the display region 106 and the peripheral region surrounded by thefirst dam 210. Alternatively, the second layer 184 is arranged so as tooverlap with the sidewall of the first dam 210 but not to cross over thefirst dam 210.

The resin layer 190 is provided over the passivation film 180 and isformed so that the second layer 184 is confined by the resin layer 190and the first layer 182. Therefore, an edge portion of the resin layer190 is farther from the display region 106 and closer to the upper sideof the substrate 102 compared with that of the second layer 184. Notethat although the resin layer 190 overlaps with the sidewall of thesecond dam 212, the resin layer 190 is arranged so as to not cross overthe second dam 212.

The resin layer 190 and the opposing substrate 116 are fixed to eachother with the adhesive layer 192. As shown in FIG. 4, the adhesivelayer 192 may be disposed so as to cover a side surface of the resinlayer 190 and an outer side of the second dam 212 (an opposite side withrespect to the display region 106).

As described above, the resin layer 190 is selectively provided in theregion surrounded by the second dam 212, while the passivation film 180is selectively provided in the region surrounded by the first dam 210.Hence, when etching is carried out by using the resin layer 190 as amask, the passivation film 180 is protected by the resin layer 190. As aresult, it is possible to prevent damage of the passivation film 180 andmaintain the high sealing ability of the passivation film 180.

Additionally, the first edge portion and the second edge portion of theauxiliary wiring 204 are covered by the partition wall 170. Hence,deterioration of the edge portions of the auxiliary wiring 204 andentrance of impurities from the edge portions of the auxiliary wiring204 can be prevented, which enables production of a display device withhigh reliability.

As described in the Second Embodiment, the opposing electrode 166 can beformed by evaporatively depositing a metal such as silver and magnesium,and a shape thereof is controlled by using a metal mask. However, it isrelatively difficult to precisely control a position of an edge portionof the opposing electrode 166 because, when a metal film is preparedwith a metal mask, metal vapor readily reaches outside an opening of ametal mask. Hence, a part of the opposing electrode 166 may be formedoutside a region covered by the passivation film 180 depending onalignment accuracy of a metal mask or conditions of evaporation. In thiscase, the edge portion of the opposing electrode 166 is not protected bythe passivation film 180, which allows water and oxygen to enter fromoutside, leading to deterioration of the light-emitting element 160.

In addition, the metal (e.g., an alloy of silver and magnesium) used forthe second conductive layer 162_2 of the auxiliary wiring 204 relativelyreadily transmits water and oxygen and causes deterioration of thelight-emitting element 160. However, the shape thereof can be accuratelycontrolled because the auxiliary wiring 204 is prepared by utilizingphotolithography using a resist mask.

Hence, as demonstrated by the structure described above, the formationof the openings 214 on a side of the second edge of the auxiliary wiring204 significantly decreases the possibility that the edge portion of theopposing electrode 166 reaches the region which is not covered by thepassivation film 180. Accordingly, the problems described above can beavoided, and high reliability can be provided to the display device 100.

3-2. Structure of Long Side of Substrate

The structure of the peripheral region and the display region 106(regions 102_2 and 102_3 in FIG. 1) close to the sides (hereinafter,referred to as long sides or second and third sides) perpendicular tothe upper side of the substrate 102 is explained below. An explanationof the structure the same as those described above may be omitted.

Schematic top views of the regions 102_2 and 102_3 are shown in FIG. 7and FIG. 9, respectively. Schematic views of cross sections along achain line B-B′ in FIG. 7 and a chain line C-C′ in FIG. 9 are shown inFIG. 8 and FIG. 10, respectively. As shown in these drawings, thegate-side driver circuits 108 are disposed in the peripheral regionbetween the display region 106 and the long sides of the substrate 102,and wirings 224 for supplying a variety of signals to the gate-sidedriver circuits 108 are arranged between the gate-side driver circuit108 and the edge portion of the substrate 102. An example is shown inFIG. 7 to FIG. 10 in which the wirings 224 exist in the same layer asthe gate electrode 134. However, the wirings 224 may exist in the samelayer as the source/drain electrodes 136 and 138.

Similar to the structure of the peripheral region and the display region106 close to the upper side of the substrate 102, the leveling film 150extends from the display region 106 to the peripheral region and coversthe gate-side driver circuits 108. The first dam 210 existing in thesame layer as the leveling film 150 and the second dam 212 surroundingthe first dam 210 are further provided in the peripheral region. Thethird interlayer film 154 covers the first dam 210 and the second dam212.

The auxiliary wiring 204 existing in the same layer as the pixelelectrode 162 is formed over the leveling film 150. The auxiliary wiring204 is selectively disposed in the region surrounded by the first dam210. As shown in FIG. 8 and FIG. 10, the auxiliary wiring 204 mayoverlap with the gate-side driver circuits 108 and the wirings 224.

The partition wall 170 possesses the openings exposing the pixelelectrodes 162 as well as the openings 214 for electrical connectionbetween the opposing electrode 166 and the auxiliary wiring 204. Asdescribed above, it is not always necessary to form the plurality ofopenings 214, and electrical connection may be achieved by one opening214 extending in a direction parallel to the long side of the substrate102. The partition wall 170 covers the edge portions of the pixelelectrodes 162 in the display region 106 and covers the first edgeportion and the second edge portion of the auxiliary wiring 204 and thefirst dam 210 in the peripheral region.

The passivation film 180 is selectively formed in the region surroundedby the first dam 210. In addition, the resin layer 190 is selectivelyprovided in the region surrounded by the second dam 212. Thus, thepassivation film 180 can be protected by the resin layer 190 duringetching using the resin layer 190 as a mask, by which high reliabilitycan be provided to the display device 100.

3-3. Structure of Lower Side of Substrate

The structure of the peripheral region and the display region 106(region 102_4 in FIG. 1) close to a lower side of the substrate 102,that is, the side (also referred to as a fourth side) along which theterminals 112 are arranged, is explained below. An explanation of thestructure the same as those described above may be omitted.

A schematic top view of the region 102_4 and a schematic view of a crosssection along a chain line D-D′ in FIG. 11 are shown in FIG. 11 and FIG.12, respectively. As shown in FIG. 11, the source-side driver circuit118 including analogue switches and the like is disposed between thedisplay region 106 and the lower side, and wirings 226 extend from thesource-side driver circuit 118 to the terminals 112. As shown in FIG.11, the wirings 226 may be arranged so as to incline from the long sideand short side of the substrate 102. Image signals are supplied to thepixels 104 through the wirings 226. As shown in FIG. 12, the wirings 226exist in the same layer as the gate electrode 134 in the example shownin FIG. 11. However, the wirings 220 may be formed with a layer which isthe same as the source/drain electrodes 136 and 138.

Wirings 228 and 230 are further provided in the peripheral region. Thereis no limitation to the function and usage of these wirings 228 and 230,and the wirings 228 and 230 each may be used as a wiring for supplying apotential to the pixel electrodes 162 and the opposing electrode 166, awiring for supplying an initialization potential to each pixel 104, or awiring for supplying signals for controlling the driver circuits.Furthermore, the wirings 228 and 230 may be formed in the same layer asthe source/drain electrode 136 and 138 or may be formed between thefirst interlayer film 124 and the second interlayer film 126 as long asthe wirings 228 and 230 are in a layer different from the wirings 226.In the example shown in FIG. 11 and FIG. 12, the wiring 228 is disposedbetween the first interlayer film 124 and the second interlayer film126. On the other hand, the wiring 230 is formed by using the layer thesame as the source/drain electrodes 136 and 138, is electricallyconnected to the auxiliary wiring 204, and supplies a constant potentialto the opposing electrode 166.

Similar to the structure of the peripheral region and the display region106 close to the upper side of the substrate 102, the leveling film 150extends from the display region 106 to the peripheral region and coversthe source-side driver circuit 118. The first dam 210 existing in thesame layer as the leveling film 150 and the second dam 212 surroundingthe first dam 210 are arranged in the peripheral region.

The auxiliary wiring 204 existing in the same layer as the pixelelectrodes 162 is formed over the leveling film 150. The auxiliarywiring 204 is selectively provided in the region surrounded by the firstdam 210. As shown in FIG. 11 and FIG. 12, the auxiliary wiring 204 mayoverlap with the source-side driver circuit 118, wirings 226, and thewiring 228. The auxiliary wiring 204 is electrically connected to thewiring 230 through an opening formed in the third interlayer film 154 inthe region surrounded by the leveling film 150 and the first dam 210.The wiring 230 is applied with a constant potential, thereby supplying aconstant potential to the opposing electrode 166.

The partition wall 170 possesses the openings for exposing the pixelelectrodes 162 in the display region 106 as well as the openings 214 forelectrical connection between the opposing electrode 106 and theauxiliary wiring 204. As described above, it is not always necessary toform the plurality of openings 214, and one opening 214 extending in adirection parallel to the lower side of the substrate 102 may beprovided. The partition wall 170 covers the edge portions of the pixelelectrodes 162 in the display region 106 and covers the first edgeportion and the second edge portion of the auxiliary wiring 204 and thefirst dam 210 in the peripheral region.

The passivation film 180 is selectively formed in the region surroundedby the first dam 210. Additionally, the resin layer 190 is selectivelyformed in the region surrounded by the second dam 212. Hence, thepassivation film 180 can be protected by the resin layer 190 duringetching using the resin layer 190 as a mask, by which high reliabilitycan be provided to the display device 100.

FIG. 13 and FIG. 14 show an example in which a part of the wirings 226exists in the same layer as the gate electrode 134 (that is, between thegate insulating film 122 and the first interlayer film 124) and anotherpart thereof is included between the first interlayer film 124 and thesecond interlayer film 126. FIG. 13 is a schematic top view of theregion 102_4, and FIG. 13 is a schematic view of a cross section along achain line E-E′ in FIG. 13.

As shown in FIG. 13, wirings 226_1 existing in the same layer as thegate electrode 134 extend from the source-side driver circuit 118 in adirection inclined from the long side and the short side of thesubstrate 102. Each of the wirings 226_1 bends in the peripheral regionand possesses a portion substantially parallel to the long side. Inaddition, these wirings 226_1 are alternately connected to wirings 226_2existing between the first interlayer film 124 and the second interlayerfilm 126. The wirings 226_2 also extend in a direction inclined from thelong side and the short side of the substrate 102.

The potential supplied to the opposing electrode 166 is provided to awiring 230_2 existing in the same layer as the source/drain electrodes136 and 138. The wiring 230_2 may be arranged so as to overlap with thewirings 226_1 and 226_2. The wirings 226_1 and 226_2 alternate with eachother under the wiring 230_2. The wiring 230_2 is electrically connectedto the wiring 228 arranged between the first interlayer film 124 and thesecond interlayer film 126 through an opening formed in the secondinterlayer film 126. The wiring 228 is further connected to a wiring230_1 existing in the same layer as the source/drain electrodes 136 and138 through an opening formed in the second interlayer film 126. Thewiring 230_1 is connected to the auxiliary wiring 204 in an openingformed in the leveling film 150 and the third interlayer film 154.

In the example shown in FIG. 13 and FIG. 14, the first dam 210 and thesecond dam 212 are disposed so as to overlap with the wiring 228.However, the positional relationship of the first dam 210 and the seconddam 212 is not limited thereto. In this example, the passivation film180 is also selectively formed in the region surrounded by the first dam210, and the resin layer 190 is selectively formed in the regionsurrounded by the second dam 212. Hence, high reliability can beprovided to the display device 100.

As can be understood from FIG. 1 and the structures of the peripheralregions close to the first to fourth sides, the auxiliary wiring 204possesses a closed shape surrounding the display region 106 and iselectrically connected to the opposing electrode 166. Moreover, sincethe auxiliary wiring 204 may have the same stacked-layer structure asthe pixel electrodes 162 as described above, the auxiliary wiring 204possesses a sufficiently low electrical resistance. Hence, even if sheetresistance of the opposing electrode 166 is high, a potential can beevenly applied to the opposing electrode 166. As a result, irregularityin luminance does not occur in the display region 106, allowing thedisplay device 100 to provide a high-quality image.

Second Embodiment

In the present embodiment, a manufacturing method of the display device100 is explained while illustratively showing the peripheral region andthe display region 106 close to the first side. An explanation of thestructure the same as that of the First Embodiment may be omitted.

FIG. 15A demonstrates a state where the undercoat 120, the transistor130, and the wirings 220 and 222 are formed over the substrate 102. Anexplanation is omitted because these elements can be fabricated withwidely known materials and methods. From this state, the leveling film150 in addition to the first dam 210 and the second dam 212 is formedover the transistor 130 and the wirings 220 and 222. Specifically, amonomer or oligomers of the polymer material described in the FirstEmbodiment are applied over the transistor 130 and the wirings 220 and222 with a wet-type film-formation method such as a spin-coating method,a printing method, and an ink-jet method (FIG. 15B) and subjected toexposure through a photomask, and then development is performed. Heatingmay be conducted after exposure to further induce curing of the monomeror oligomers. With this process, the leveling film 150 having theopening for exposing the source/drain electrode 138, the first dam 210,and the second dam 212 are formed (FIG. 16A).

After that, the connection electrode 152 covering the opening and incontact with the source/drain electrode 138 is formed (FIG. 16A). Theconnection electrode 152 may include a conductive oxide having alight-transmitting property, such as ITO and IZO, and may be formed byapplying a sputtering method, for example.

Next, the third interlayer film 154 is formed so as to cover theleveling film 150, the first dam 210, and the second dam 212. The thirdinterlayer film 154 is formed with a sputtering method or a chemicalvapor deposition (CVD) method. After that, etching is conducted on thethird interlayer film 154 to prepare the opening exposing a top surfaceof the connection electrode 152 (FIG. 16B). The opening (see FIG. 2A)for direct contact of the leveling film 150 with the partition wall 170may be simultaneously formed.

After that, the pixel electrode 162 and the auxiliary wiring 204 aresimultaneously formed. When the pixel electrode 162 and the auxiliarywiring 204 have the stacked-layer structure shown in FIG. 2B, the firstconductive layer 162_1 is formed by sputtering a conductive oxide havinga light-transmitting property, the second conductive layer 162_2including a metal such as silver and aluminum is formed with asputtering method or a CVD method, and then the third conductive layer162_3 is formed by sputtering a conductive oxide having alight-transmitting property, for example. After that, etching isperformed so that the pixel electrode 204 and the auxiliary wiring 204are physically separated from each other, resulting in the formation ofthe pixel electrode 162 and the auxiliary wiring 204 (FIG. 16B).

Next, the partition wall 170 is prepared. Specifically, a monomer oroligomers serving as a raw material of a polymer such as an epoxy resin,an acrylic resin, or a polyimide are applied with a wet-typefilm-formation method, and exposure and development are conducted, bywhich the partition wall 170 is fabricated (FIG. 17A). A photomask isdesigned so that the opening exposing the pixel electrode 162 and theopening exposing the auxiliary wiring 204 are formed in the partitionwall 170. As described in the First Embodiment, the partition wall 170covers the edge portions of the pixel electrodes 162, the first edgeportion and the second edge portion of the auxiliary wiring 204, and thefirst dam 210. As shown in FIG. 17A, it is preferred that an edgeportion of the opening of the partition wall 170 have a tapered shape.

Next, the organic layer 164 is formed so as to cover the partition wall170 and the pixel electrode 162 (FIG. 17A). The organic layer 164 may beformed by applying an evaporation method or a wet-type film-formationmethod. After that, the opposing electrode 166 is formed so as to coverthe organic layer 164 and be in contact with the auxiliary wiring 204 inthe opening 214 (FIG. 17B). The opposing electrode 166 may also beprepared with an evaporation method or a sputtering method. Throughthese processes, the light-emitting element 160 is fabricated.

After that, the passivation film 180 is formed. Specifically, the firstlayer 182 is first formed by using a sputtering method or a CVD methodso as to cover the partition wall 170 overlapping with the opposingelectrode 166 and the shielding region 156_1, the first dam 210, and thesecond dam 212 as shown in FIG. 18A. At this time, the first layer 182is also formed over the terminals 112. The second layer 184 is nextformed over the first layer 182. The second layer 184 can be formed byapplying a monomer or oligomers serving as a raw material of a polymermaterial such as an epoxy region or an acrylic resin and then curing themonomer or oligomers. Alternatively, the second layer 184 may beprepared by atomizing or gasifying the monomer or oligomers under areduced pressure, spraying the first layer 182 with the monomer oroligomers, and then polymerizing the monomer or oligomers.

At this time, it is possible to selectively apply the monomer oroligomers in the region surrounded by the first dam 210 due to the firstdam 210 as well as the projection of the partition wall 170 caused bythe first dam 210. Namely, it is possible to prevent the monomer oroligomers from flowing to the outside of the shielding region 156_2 andthe first dam 210. As a result, the second layer 184 can be selectivelyformed in the region surrounded by the first dam 210.

Next, the third layer 186 is formed so as to cover the second layer 184,the first dam 210, and the second dam 212. The third layer 186 can beformed with the same method as that of the first layer 182. The thirdlayer 186 is also formed so as to overlap with the terminals 112. Withthis procedure, the second layer 184 can be sealed by the first layer182 and the third layer 186.

Next, the resin layer 190 is formed. The resin layer 190 is formed byapplying a monomer or oligomers serving as a raw material of the polymermaterial described in the First Embodiment with a wet-typefilm-formation method, and then exposing and curing the monomer andoligomers. At this time, the monomer or oligomers can be selectivelyapplied in the region surrounded by the second dam 212 due to the seconddam 212 as well as the projection of the first layer 182 and the thirdlayer 186 caused by the second dam 212 (FIG. 18B). In other words, theresin layer 190 is selectively formed in the region surrounded by thesecond dam 212. After that, etching (e.g., dry etching) is performedusing the resin layer 190 as a mask to remove the first layer 182 andthe third layer 186 formed over the terminals 112 and expose theterminals 112. At this time, as shown in FIG. 18B, the first layer 182and the third layer 186 which are not covered by the resin layer 190 arealso removed in the vicinity of the first side, by which the position ofthe edge portion of the passivation film 180 is determined. Therefore, abottom side of the side surface of the resin layer 190 matches an uppersurface of the sidewall of the third layer 186. Moreover, a side surfaceof the first layer 182 and a side surface of the third layer 186 canexist in the same plane.

After that, the adhesive layer 192 is formed by using an acryl-based,epoxy-based, or acrylate-based adhesive, for example, and the opposingsubstrate 116 is fixed over the resin layer 190. The adhesive layer 192may be formed so as to cover the side surface of the resin layer 190(FIG. 4). Through the processes described above, the display device 100is manufactured.

As described above, since the resin layer 190 is formed with a wet-typefilm-formation method, the position of the edge portion thereof is notalways readily controlled precisely. therefore, if the resin layer 190does not entirely cover the passivation film 180 and the passivationfilm 180 is partly exposed from the resin layer 190, the passivationfilm 180 is damaged in the following etching process, which allowsimpurities such as water and oxygen to enter the display region 106through the second layer 184 having relatively high hydrophilicity. As aresult, the light-emitting element 160 deteriorates, and reliability ofthe display device 100 decreases.

However, spreading of the monomer or oligomers giving the second layer184 is restricted by the first dam 210 because the second layer 184 issealed by the first layer 182 and the third layer 186 as describedabove. Hence, the second layer 184 is selectively formed in the regionsurrounded by the first dam 210. Similarly, spreading of the monomer oroligomers giving the resin layer 190 is restricted by the second dam212, which allows the selective formation of the resin layer 190 in theregion surrounded by the second dam 212. Accordingly, the stacked-layerstructure of the first layer 182, the second layer 184, and the thirdlayer 186 is covered by the resin layer 190 and is not exposed from theresin layer 190. Thus, the stacked-layer structure of the first layer182, the second layer 184, and the third layer 186 is not damaged in theetching process to expose the terminals 112, and the high sealingfunction of the passivation film 180 is not lost. As a result, highreliability can be provided to the display device 100.

Third Embodiment

In the present embodiment, a modified example of the display device 100is explained. Schematic cross-sectional views of the regions 102_1,102_2, and 102_4 are illustrated in FIG. 19, FIG. 20, and FIG. 21,respectively. As shown in these drawings, the structure of the modifiedexample is different from that of the display device 100 in that thepartition wall 170_2 covering the first dam 210 is spaced from thepartition wall 170_1 covering the edge portions of the pixel electrodes162. The partition wall 170_1 has the opening 214 exposing the auxiliarywiring 204, and the auxiliary wiring 204 is electrically connected tothe opposing electrode 166 through this opening. Similar to the displaydevice 100 shown in FIG. 6, the auxiliary wiring 204 is in contact withthe first layer 182 in the shielding region 156_1.

In a case where viscosity of the monomer or oligomers giving the resinlayer 190 or viscosity of a mixture including the monomer or oligomersis extremely high or in a case where an amount of the monomer oroligomers to be applied is insufficient, the resin layer 190 may not beable to cover the edge portion of the passivation film 180 (FIG. 22A).In this case, as shown in FIG. 22B, the edge portion of the passivationfilm 180 is etched, and the portion of the passivation film 180, whichis not covered by the resin layer 190, is lost in the following etchingprocess so that the partition wall 170_2 is exposed. However, there isno route for transporting impurities such as water and oxygen to thepartition wall 170_2 in the modified example explained in the presentembodiment because the partition wall 170_2 is spaced from the partitionwall 170_1 in contact with the light-emitting elements 160. As a result,the influence of impurities on the light-emitting element 160 isnegligible, and reliability of the display device 100 can be secured.

Fourth Embodiment

In the present embodiment, a modified example of the display device 100is explained. Schematic cross-sectional views of the regions 102_1,102_2, and 102_4 are illustrated in FIG. 23, FIG. 24, and FIG. 25,respectively. As shown in these drawings, the present modified exampleis different from the display device 100 and the modified exampleexplained in the Third Embodiment in that a single dam (first dam 210)is provided in the peripheral region. In this case, it is preferred thatthe first layer 182 and the third layer 186 be prepared by applying asputtering method while covering the terminals 112 with a mask. In thepresent modified example, the etching process of the first layer 182 andthe third layer 186 is not necessary, and it is not necessary to formthe second dam 212 and the shielding region 156_2. Hence, an area of theperipheral region can be reduced, and a display device having a displayregion 106 with a wide area can be manufactured.

The modes described above as the embodiments of the present inventioncan be implemented by appropriately combining with each other as long asno contradiction is caused. Furthermore, any mode which is realized bypersons ordinarily skilled in the art through the appropriate addition,deletion, or design change of elements or through the addition,deletion, or condition change of a process is included in the scope ofthe present invention as long as they possess the concept of the presentinvention.

In the specification, although the cases of the organic EL displaydevice are exemplified, the embodiments can be applied to any kind ofdisplay devices of the flat panel type such as other self-emission typedisplay devices, liquid crystal display devices, and electronic papertype display device having electrophoretic elements and the like. Inaddition, it is apparent that the size of the display device is notlimited, and the embodiment can be applied to display devices having anysize from medium to large.

It is properly understood that another effect different from thatprovided by the modes of the aforementioned embodiments is achieved bythe present invention if the effect is obvious from the description inthe specification or readily conceived by persons ordinarily skilled inthe art.

What is claimed is:
 1. A display device comprising: a substrate having adisplay region and a peripheral region surrounding the display region; apixel over the display region; a passivation film over the pixel, thepassivation film including: a first layer containing an inorganiccompound; a second layer over the first layer, the second layercontaining an organic compound; and a third layer over the second layer,the third layer containing an inorganic compound; a dam over theperipheral region and surrounding the display region; and at least onewiring over the peripheral region and extending between the dam and anedge of the substrate, wherein the second layer is selectively arrangedin a region surrounded by the dam.
 2. The display device according toclaim 1, wherein the at least one wiring does not overlap with the damin a plan view.
 3. The display device according to claim 1, wherein thepixel comprises: a pixel electrode; an organic layer over the pixelelectrode; and an opposing electrode over the organic layer, and the atleast one wiring is electrically isolated from the opposing electrode.4. The display device according to claim 1, further comprising a resinlayer over the passivation film, wherein the first layer, the thirdlayer and the resin layer are located on the dam.
 5. The display deviceaccording to claim 1, further comprising a resin layer over thepassivation film, wherein the first layer and the third layercontinuously extend to the peripheral region from the display region toentirely cover the dam, and the resin layer entirely covers the displayregion and continuously extends to the peripheral region from thedisplay region to entirely cover the dam.
 6. The display deviceaccording to claim 4, further comprising an opposing substrate, whereinthe resin layer is an adhesive layer to attach the substrate to theopposing substrate.
 7. The display device according to claim 5, furthercomprising an opposing substrate, wherein the resin layer is an adhesivelayer to attach the substrate to the opposing substrate.
 8. The displaydevice according to claim 4, wherein the resin layer covers an edgeportion of the first layer and an edge portion of the third layer. 9.The display device according to claim 5, wherein the resin layer coversan edge portion of the first layer and an edge portion of the thirdlayer.
 10. The display device according to claim 1, wherein the thirdlayer covers an edge portion of the first layer.
 11. A display devicecomprising: a substrate having a display region and a peripheral regionsurrounding the display region; a pixel over the display region, thepixel including: a pixel electrode; an organic layer over the pixelelectrode; and an opposing electrode over the organic layer; apassivation film over the pixel, the passivation film including: a firstlayer containing an inorganic compound; a second layer over the firstlayer, the second layer containing an organic compound; and a thirdlayer over the second layer, the third layer containing an inorganiccompound; a dam over the peripheral region and surrounding the displayregion; and a wiring disposed over the peripheral region and between thepixel electrode and the substrate and is electrically connected to theopposing electrode, wherein the second layer is selectively arranged ina region surrounded by the dam; the dam is in direct contact with thewiring, and the dam is disposed inside the wiring in a plan view. 12.The display device according to claim 11, further comprising a resinlayer over the passivation film, wherein the first layer, the thirdlayer and the resin layer are located on the dam.
 13. The display deviceaccording to claim 11, further comprising a resin layer over thepassivation film, wherein the first layer and the third layercontinuously extend to the peripheral region from the display region toentirely cover the dam, and the resin layer entirely covers the displayregion and continuously extends to the peripheral region from thedisplay region to entirely cover the dam.
 14. The display deviceaccording to claim 12, further comprising an opposing substrate, whereinthe resin layer is an adhesive layer to attach the substrate to theopposing substrate.
 15. The display device according to claim 13,further comprising an opposing substrate, wherein the resin layer is anadhesive layer to attach the substrate to the opposing substrate. 16.The display device according to claim 12, wherein the resin layer coversan edge portion of the first layer and an edge portion of the thirdlayer.
 17. The display device according to claim 13, wherein the resinlayer covers an edge portion of the first layer and an edge portion ofthe third layer.
 18. The display device according to claim 11, whereinthe third layer covers an edge portion of the first layer.